Publication detail

ANSYS Thermal Modelling of Thick Film Structures

BÍLEK, J.

Original Title

ANSYS Thermal Modelling of Thick Film Structures

English Title

ANSYS Thermal Modelling of Thick Film Structures

Type

conference paper

Language

Czech

Original Abstract

This paper focuses on the mathematical modelling in thick film applications using ANSYS software. The creation of the model and simplifications made during the process are described and discussed, theory of the thermal modelling is briefly introduced. A comparison between the model and measurements using an infrared camera is also presented and recommendations for other possible thermal analyses are given.

Keywords

thick film, modelling, ANSYS

Key words in English

thick film, modelling, ANSYS

Authors

BÍLEK, J.

Released

25. 4. 2002

Publisher

FEI VUT Brno

Location

Brno

ISBN

80-214-2115-0

Book

Proceeding of 8th conference STUDENT EEICT 2002

Edition number

1

Pages from

193

Pages to

197

Pages count

5

BibTex

@inproceedings{BUT4606,
  author="Jaromír {Bílek}",
  title="ANSYS Thermal Modelling of Thick Film Structures",
  booktitle="Proceeding of 8th conference STUDENT EEICT 2002",
  year="2002",
  number="1",
  pages="5",
  publisher="FEI VUT Brno",
  address="Brno",
  isbn="80-214-2115-0"
}