Publication detail

Chybí název

BULVA, J., SZENDIUCH, I.

Original Title

Chybí název

Type

abstract

Language

English

Original Abstract

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu).

Key words in English

ANSYS, modelling, MSM

Authors

BULVA, J., SZENDIUCH, I.

Released

2. 2. 2005

Publisher

Universitat Rovira i Virgili

Location

Tarragona

Pages from

141

Pages to

141

Pages count

1

BibTex

@misc{BUT60034,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Chybí název",
  booktitle="5a Conferencia de Dispositivos Electrónicos",
  year="2005",
  pages="1",
  publisher="Universitat Rovira i Virgili",
  address="Tarragona",
  note="abstract"
}