Publication detail

Cheep Solution for MSM (MMS)

ŠANDERA, J., SZENDIUCH, I.

Original Title

Cheep Solution for MSM (MMS)

Type

conference paper

Language

English

Original Abstract

Multisubstrate modeles are new solution in 3D package construction. There are some new principles described in this paper

Keywords

MCM, MSM, Ceramic and laminate

Authors

ŠANDERA, J., SZENDIUCH, I.

RIV year

2003

Released

24. 6. 2003

Publisher

IMAPS Germany

Location

Friedrichshafen, BRD

Pages from

436

Pages to

440

Pages count

5

URL

knihovna ÚMEL

BibTex

@inproceedings{BUT8713,
  author="Josef {Šandera} and Ivan {Szendiuch}",
  title="Cheep Solution for MSM (MMS)",
  booktitle="14th European Microelectronics and Packaging Conference",
  year="2003",
  volume="2003",
  pages="5",
  publisher="IMAPS Germany",
  address="Friedrichshafen, BRD",
  url="knihovna ÚMEL"
}