Detail publikace

Modelling of 3D Multimodule Substrate

BULVA, J., SZENDIUCH, I.

Originální název

Modelling of 3D Multimodule Substrate

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today’s electronic devices – FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps changed diameter.

Klíčová slova v angličtině

MSM, reliability, thermomechanical properties, packaging, modelling, ANSYS

Autoři

BULVA, J., SZENDIUCH, I.

Rok RIV

2003

Vydáno

1. 1. 2003

Nakladatel

International Microelectronics and Packaging Society Poland-Chapter

Místo

Gliwice, Poland

ISBN

83-917701-0-9

Kniha

Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003

Edice

Neuveden

Číslo edice

Neuveden

Strany od

126

Strany do

129

Strany počet

4

BibTex

@inproceedings{BUT8127,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Modelling of 3D Multimodule Substrate",
  booktitle="Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003",
  year="2003",
  series="Neuveden",
  volume="Neuveden",
  number="Neuveden",
  pages="4",
  publisher="International Microelectronics and Packaging Society Poland-Chapter",
  address="Gliwice, Poland",
  isbn="83-917701-0-9"
}