Course detail

Printed Circuits and Surface Mount Technology

FEKT-CPSMAcad. year: 2009/2010

Basic materials for production of printed circuit boards (PCB), their properties, application and comparison with inorganic substrates. Technological procedures of production of single-, double- and multi-layer PCBs. New technological trends of PCB production with emphasis on microconnecting structures (HDI). Surface mount technology (SMT), throuh hole technology (THT) and combined mounting of electronic parts. Acquaintance with the mounting process starting by parts and used chemistry at the beginning up to repairs and quality requirements.

Language of instruction

English

Number of ECTS credits

5

Mode of study

Not applicable.

Guarantor

Ing. Jiří Starý, Ph.D.

Department

Department of Electrical and Electronic Technology (UETE)

Learning outcomes of the course unit

The student will be able to orientated themselves fully in extensive problems connected with production of printed circuit boards.

Prerequisites

The subject knowledge on the secondary school education level is requested.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

The aim of the subject is to make students familiar with the problems of printed circuit boards production and to initiate them into the possibilities of material and technology, which are available at present time.

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

LEA, C.: A Scientific Guide to Surface Mount Technology, Electrochemical Publications Ltd., GB 1998 (EN)
Wassing, R.J.K.:Manufacturing Techniques for Surface Mounted Assemblies, Electrochemical Publications Ltd. GB 1995 (EN)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme EEKR-BC Bachelor's

    branch BC-MET , 3. year of study, winter semester, compulsory

Type of course unit

 

Lecture

26 hours, compulsory

Teacher / Lecturer

Ing. Jiří Starý, Ph.D.

Syllabus

Basic organic materials, kinds of bonding agent stiffeners, plated basic materials. Solid and flexible basic organic materials.
Basic organic materials, electrical, mechanical and also heat properties. Basic inorganic materials and comparison with organic materials.
Principles of PCB design, form and size of soldering spots and conductive paths. Principles of design for wave soldering and soldering by remelting.
Principles of PCB design, design of non-soldering mask, design of soldering spots for BGA and CSP, examples of footprints for SMT
Mounting and interconnecting structures, kinds. Subtractive, semiadditive and additive methods of production of mounting and interconnecting structures. Major application trends in electrotechnics.
Technological procedures of production of single-layer, double-layer and multi-layer PCB. Microinterconnecting (microvia) structures, MID. Separate operations of production process.
Assembly, surface and combined mount of PCB. Technological procedures. New trends in SMT.
Chemistry in mounting process and its correct choice (soldering paste, soldering alloys, adhesives, fluxing agents conformal coatings, packaging materials)
Application technologies (screen process printing, stencil printing, dispension). Process of SMD population, populating automatic machines, principles, methods of component centering .
SMD, properties and execution, outlets of parts, packages for IO, passive parts, electromechanical elements, BGA packages, design.
Soldering, methods of soldering, soldered connection and reliability of soldered connection. Machine soldering by wave, influence of nitrogen protective atmosphere. Manual soldering, principles.
Reflow soldering, methods, forced convection and influence of nitrogen atmosphere. Measurement of temperature profiles. Testing of non-populated and populated DPS, quality checking, checking methods.
Repairs of DPS, contact and contactless methods of assembly/disassembly. Principles and technique of repairs. Requirements on DPS according to IPC and Czech standards, antistatic prevention.

Exercise in computer lab

4 hours, compulsory

Teacher / Lecturer

Ing. Jiří Starý, Ph.D.

Syllabus

Design system - basic rules
Design system and technological outputs

Laboratory exercise

18 hours, compulsory

Teacher / Lecturer

Ing. Jiří Starý, Ph.D.

Syllabus

Organic basic materials, properties. Principles of choice of material.
Production of single-layer and double-layer PCB on the line BUNGARD/PROTOCAD.
Soldering paste, adhesives, fluxing agents. Properties and distribution Technical and safety sheets, manipulation and storing, principles.
Screen process printing/template printing. Screens, templates, properties. Printing of soldering paste. Factors influencing quality of print, defects and their reasons.
Semiautomatic population of SMD, creating program. Dispension of adhesive. Population of SMD into soldering paste. Mounting procedures, discussion.
Reflow soldering with solder paste, measuring of temperature profiles and principles. Defects of soldered joints. Test of the solder paste for solder balling.
Repairs of assembly units by contact method/hot air. Assembly/disassembly of chips (0805, 1206), SOIC, QFP.
Requirements for population and soldering of SMD. Checking quality of assembly unit according to IPC-A-610B.

The other activities

4 hours, compulsory

Teacher / Lecturer

Ing. Jiří Starý, Ph.D.

Syllabus

Excursion to PCB mounting plant
Excursion to PCB production plant.