Project detail

Evaluation of fracture mechanics parameters for cracks in anisotropic bimaterial media using the technique of continuously distributed dislocations

Duration: 01.01.2005 — 31.12.2007

Funding resources

Czech Science Foundation - Postdoktorandské granty

- whole funder (2005-01-01 - 2007-12-31)

On the project

Projekt je zaměřen na řešení několika technicky významných konfigurací trhlin v blízkosti rozhraní dvou anisotropníchelastických materi álů pomocí metody spojitě rozložených dislokací, která umožňuje výpočet hodnot faktoru intenzity napětí a T napětí.

Description in English
Study of cracks problems in anisotropic heterogeneous media is of a great relevance for understanding of stability and kinetic of cracks in i) single crystals, ii) microcracks whose length is of the order of grain size in polycrystalline materials, and iii) cracks in composite materials whose anisotropy is related to their artificial architecture. An ever increasing use of composite materials (i.e. aerospace industry, automotive industry) invokes a need of a reliable fracture mechanics analysis of cracks behaviour in anisotropic bodies including effects of the presence of interfaces between individual constituents. The project is focused on the solution of several, technologically important configurations of cracks near the interface of two anisotropicmaterials using of the technique of continuously distributed dislocations, allowing to determine fracture mechanics parameters such as stress intensities and T- stresses. The part of the project is a development of an auxiliary solution for

Mark

GP101/05/P290

Default language

Czech

People responsible

Profant Tomáš, doc. Ing., Ph.D. - principal person responsible

Units

Institute of Materials Science and Engineering
- beneficiary (2005-01-01 - 2007-12-31)

Results

PROFANT, T.; KOTOUL, M. Effect of thermal expansion mismatches of matrix and fibres on microcracking of brittle matrix composites. In Aplikovaná mechanika 2005. Brno: ÚMTMB FSI v Brně, 2005. p. 85-86. ISBN: 80-214-2373-0.
Detail

ŠEVEČEK, O.; PROFANT, T.; KOTOUL, M. Řešení problému přemostění trhliny v tenké ortotropní vrstvě s vrcholem na rozhraní ortotropního substrátu. In Applied Mechanics 2007. Ediční středisko VŠB. Ostrava: VŠB Technická universita Ostrava, 2007. s. 207-208. ISBN: 978-80-248-1389-9.
Detail

ŠEVEČEK, O.; PROFANT, T.; KOTOUL, M. Crack propagation criteria for the crack terminating on the interface of a thin orthotropic layer and an orthotropic substrate. In Engineering Mechanics 2007. Prague: Institute of thermomechanics Academy of science of the Czech Republic, 2007. p. 271-272. ISBN: 978-80-87012-06-2.
Detail

PROFANT, T.; ŠEVEČEK, O.; KOTOUL, M. Stress field analisys near the semi-infinite crack tip terminating to the interface between two orthotropic materials. In Engineering Mechanics 2006. první. Svratka: Academy of Sciences of the Czech Republic, Prague, 2006. s. 304-305. ISBN: 80-86246-27-2.
Detail

PROFANT, T.; ŠEVEČEK, O.; KOTOUL, M. ANALÝZA SINGULARITY NAPĚTÍ U TRHLIN NA ROZHRANÍ DVOU ORTOTROPNÍCH MATERIÁLŮ. In Computational Mechanics. Hrad Nečtiny: University of West Bohemia in Pilsen, 2006. s. 483-490. ISBN: 80-7043-477-5.
Detail

PROFANT, T.; ŠEVEČEK, O.; KOTOUL, M. STRESS SINGULARITY AT AN SEMI-INFINITE CRACK PERPENDICULAR TO THE INTERFACE BETWEEN TWO ORTHOTROPIC MATERIALS. In Dynamika tuhých a deformovatelných těles 2006. Ústí nad Labmem: Univerzita J.E. Purkyně, 2006. s. 175-182. ISBN: 80-7044-782-6.
Detail

PROFANT, T.; ŠEVEČEK, O.; KOTOUL, M. The Analysis of the Stress and Displacement Field Near the Surface Crack Tip Terminating Perpendicular to the Interface Between Two Orthotropic Materials. Materials Science Forum, 2007, vol. 567, no. 1, p. 137-140. ISSN: 0255-5476.
Detail

PROFANT, T.; ŠEVEČEK, O.; KOTOUL, M.: The evaluation of the exponent singularity and corresponding eigenvectors of the problem of the crack terminating perpendicular to the interface between two orthotropic materials. http://www.maplesoft.com/applications/app_center_view.aspx?AID=2231. URL: http://www.maplesoft.com/applications/view.aspx?SID=5742. (software)
Detail