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SZENDIUCH, I. PSOTA, B. OTÁHAL, A. HEJÁTKOVÁ, E.
Original Title
Board on Board New PCB Configuration Moving in 3D Packaging
Type
conference paper
Language
English
Original Abstract
This paper describes the main idea of EURIPIDES project Board on Board (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will also be highly desired. Main principle and approach is described in this paper.
Keywords
PCB, 3D packaging, reliability, vibration testing, ANSYS
Authors
SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A.; HEJÁTKOVÁ, E.
RIV year
2013
Released
26. 6. 2013
Publisher
Novapress sro
Location
Vysoké učení technické v Brně
ISBN
978-80-214-4754-7
Book
THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013
Pages from
224
Pages to
227
Pages count
4
BibTex
@inproceedings{BUT100943, author="Ivan {Szendiuch} and Boleslav {Psota} and Alexandr {Otáhal} and Edita {Hejátková}", title="Board on Board New PCB Configuration Moving in 3D Packaging", booktitle="THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013", year="2013", pages="224--227", publisher="Novapress sro", address="Vysoké učení technické v Brně", isbn="978-80-214-4754-7" }