Publication detail

Connection of Electronic and Microelectronic Modules

ŠANDERA, J.

Original Title

Connection of Electronic and Microelectronic Modules

Type

conference paper

Language

English

Original Abstract

Design electronic and microelectronic modules, owerlook of actual connection, new connections (connection with chip components)

Keywords

electronic module, thermomechanical reliability, flexible connection, rigid connection, connection with chip component

Authors

ŠANDERA, J.

RIV year

2013

Released

22. 9. 2013

Publisher

IMAPS Poland Chapter

Location

Krakow

ISBN

978-83-932464-1-0

Book

Proceedings of 37th International Microelectronic and Packaging IMAPS-CPMT Poland Conference, 22-25 September 2013, Krakow, Poland

Pages from

1

Pages to

5

Pages count

5

BibTex

@inproceedings{BUT104007,
  author="Josef {Šandera}",
  title="Connection of Electronic and Microelectronic Modules",
  booktitle="Proceedings of 37th International Microelectronic and Packaging IMAPS-CPMT Poland Conference, 22-25 September 2013, Krakow, Poland",
  year="2013",
  pages="1--5",
  publisher="IMAPS Poland Chapter",
  address="Krakow",
  isbn="978-83-932464-1-0"
}