Přístupnostní navigace
E-application
Search Search Close
Publication detail
OTÁHAL, A. ADÁMEK, M. JANSA, V. SZENDIUCH, I.
Original Title
Investigation of the Mechanical Properties of Lead-Free Solder Materials
Type
journal article - other
Language
English
Original Abstract
Reliability and life-time of electric/electronic products is still a highly actual and discussed topic. Every electric/electronic product is heterogeneous system which consists not only from components and constructional parts, but also from many interconnections. Basic segments of interconnection are solder joints, actually created by lead-free materials. The passing from well-proven lead solders to lead free compositions brought many new aspects in reliability and life-time of electronic systems. Some of the negative factors are their poor electro-mechanical properties, which are based on complicated microstructure of interlayer interface. This fact causes defects in solder joints and consequential failure of the function. This article is focused on an investigation of mechanical properties by lead-free solder joints. There are investigated various properties of common lead free solder paste depending on various concentrations of O2 by reflow process. Next, there are shown microstructures by micro sections for various concentrations of O2. Mechanical properties (mechanical strength) are tested by shear test equipment DAGE 2400.
Keywords
Soldering, lead-free solder paste, nitrogen atmosphere, shear test.
Authors
OTÁHAL, A.; ADÁMEK, M.; JANSA, V.; SZENDIUCH, I.
RIV year
2013
Released
15. 11. 2013
Publisher
Trans Tech Publications
Location
Switzerland
ISBN
1662-9795
Periodical
Key Engineering Materials (web)
Year of study
Number
592-593
State
Swiss Confederation
Pages from
453
Pages to
456
Pages count
4
URL
http://www.scientific.net/KEM.592-593.453
BibTex
@article{BUT104280, author="Alexandr {Otáhal} and Martin {Adámek} and Vojtěch {Jansa} and Ivan {Szendiuch}", title="Investigation of the Mechanical Properties of Lead-Free Solder Materials", journal="Key Engineering Materials (web)", year="2013", volume="2013", number="592-593", pages="453--456", doi="10.4028/www.scientific.net/KEM.592-593.453", issn="1662-9795", url="http://www.scientific.net/KEM.592-593.453" }