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Publication detail
BEČKOVSKÝ, D. VAJKAY, F.
Original Title
BRESET - Remote Sensing Technology for Building Physics Research of Structures
Type
conference paper
Language
English
Original Abstract
For the interaction with certain equipment engineers and scientist do have a need to build a wide range of tools under a dramatically short amount of time. This is what is referred to as BRESET (Building REmote SEnsing Technologies), a development environment created to solve issues, to have an accelerated productivity and be available for continuous innovations. The designed system is based on a credit card size minicomputer which have had brought a revolution to the computing industry, namely the Raspberry Pi, and on a prototyping platform called as Arduino - together ArduPi. From these two units the Raspberry Pi is bound to serve as the brain of the system, while the Arduino is ready to be used as an intermediary element to communicate with the sensors. The units are planned to send data through the widely known and used I2C protocol. This certain combination allows observations to be done for various fields. The connected sensors may be analogue or digital, industrial or DIY type at the exact same time. For example it would be possible to measure humidity, temperature, energy consumption and many more, with the ArduPi. The paper therefore focuses on prototyping in the field of building physics.
Keywords
Remote sensing, sensors, building research, RaspberryPi, Arduino, ArduPi, building physics, I2C, SPI
Authors
BEČKOVSKÝ, D.; VAJKAY, F.
RIV year
2014
Released
1. 3. 2014
Publisher
Trans Tech Publications
Location
Switzerland
ISBN
1022-6680
Periodical
Advanced Materials Research
Year of study
899
Number
1
State
Swiss Confederation
Pages from
575
Pages to
578
Pages count
4
BibTex
@inproceedings{BUT105747, author="David {Bečkovský} and František {Vajkay}", title="BRESET - Remote Sensing Technology for Building Physics Research of Structures", year="2014", journal="Advanced Materials Research", volume="899", number="1", pages="575--578", publisher="Trans Tech Publications", address="Switzerland", doi="10.4028/www.scientific.net/AMR.899.575", issn="1022-6680" }