Přístupnostní navigace
E-application
Search Search Close
Publication detail
BURŠÍK, M. JANKOVSKÝ, J. ŘEZNÍČEK, M. SZENDIUCH, I.
Original Title
Analytic method for monitoring of cleaning process efficiency
English Title
Type
conference paper
Language
Czech
Original Abstract
This paper is focused on cleaning processes commonly used in electronic industry. Cleaning equipment serve to remove residual contamination after soldering of components in order to achieve the highest possible reliability and efficiency. In the real cleaning process is not possible during cleaning process to move products outside from equipment to make evaluation of cleaning efficiency.
English abstract
Keywords
Cleaning, contamination, flux, analyze, monitoring
Key words in English
Authors
BURŠÍK, M.; JANKOVSKÝ, J.; ŘEZNÍČEK, M.; SZENDIUCH, I.
RIV year
2014
Released
20. 8. 2014
Publisher
IEEE
Location
Dresden, Německo
ISBN
978-3-934142-49-7
Book
IEEE CONFERENCE PUBLICATIONS
Pages from
341
Pages to
344
Pages count
4
BibTex
@inproceedings{BUT109630, author="Martin {Buršík} and Jaroslav {Jankovský} and Michal {Řezníček} and Ivan {Szendiuch}", title="Analytic method for monitoring of cleaning process efficiency", booktitle="IEEE CONFERENCE PUBLICATIONS", year="2014", pages="341--344", publisher="IEEE", address="Dresden, Německo", doi="10.1109/ISSE.2014.6887620", isbn="978-3-934142-49-7" }