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OTÁHAL, A. ADÁMEK, M. SZENDIUCH, I.
Original Title
Impact of solder paste drying on the solderability
English Title
Type
conference paper
Language
Czech
Original Abstract
This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.
English abstract
Keywords
copper alloys, drying, reflow soldering, silver alloys, solders, tin alloys
Key words in English
Authors
OTÁHAL, A.; ADÁMEK, M.; SZENDIUCH, I.
RIV year
2014
Released
20. 8. 2014
Publisher
IEEE
Location
Dresden
ISBN
978-1-4799-4455-2
Book
37th Int. Spring Seminar on Electronics Technology
Pages from
198
Pages to
201
Pages count
495
BibTex
@inproceedings{BUT109636, author="Alexandr {Otáhal} and Martin {Adámek} and Ivan {Szendiuch}", title="Impact of solder paste drying on the solderability", booktitle="37th Int. Spring Seminar on Electronics Technology", year="2014", volume="2014", number="37", pages="198--201", publisher="IEEE", address="Dresden", doi="10.1109/ISSE.2014.6887592", isbn="978-1-4799-4455-2" }