Publication detail

Impact of solder paste drying on the solderability

OTÁHAL, A. ADÁMEK, M. SZENDIUCH, I.

Original Title

Impact of solder paste drying on the solderability

English Title

Impact of solder paste drying on the solderability

Type

conference paper

Language

Czech

Original Abstract

This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.

English abstract

This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.

Keywords

copper alloys, drying, reflow soldering, silver alloys, solders, tin alloys

Key words in English

copper alloys, drying, reflow soldering, silver alloys, solders, tin alloys

Authors

OTÁHAL, A.; ADÁMEK, M.; SZENDIUCH, I.

RIV year

2014

Released

20. 8. 2014

Publisher

IEEE

Location

Dresden

ISBN

978-1-4799-4455-2

Book

37th Int. Spring Seminar on Electronics Technology

Pages from

198

Pages to

201

Pages count

495

BibTex

@inproceedings{BUT109636,
  author="Alexandr {Otáhal} and Martin {Adámek} and Ivan {Szendiuch}",
  title="Impact of solder paste drying on the solderability",
  booktitle="37th Int. Spring Seminar on Electronics Technology",
  year="2014",
  volume="2014",
  number="37",
  pages="198--201",
  publisher="IEEE",
  address="Dresden",
  doi="10.1109/ISSE.2014.6887592",
  isbn="978-1-4799-4455-2"
}