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Publication detail
MAKKI, Z. JANDA, M.
Original Title
REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD
English Title
Type
conference paper
Language
Czech
Original Abstract
The paper is focused on showing the possibility of an efficient heat removal from a thermal source to a heat sink via printed circuit board (PCB). Each solution can be described by hand calculation and simulation by Ansys Icepak software with using thermal resistance.
English abstract
Keywords
Ansys Icepak, PCB (Printed circuit board), Heat conduction, Heat spread
Key words in English
Authors
MAKKI, Z.; JANDA, M.
RIV year
2014
Released
25. 6. 2014
Location
Jasná, Slovak Republic
ISBN
978-80-905525-1-7
Book
22nd SVSFEM ANSYS Users' Group Meeting and Conference 2014
Edition number
1
Pages from
114
Pages to
118
Pages count
172
BibTex
@inproceedings{BUT109897, author="Zbyněk {Makki} and Marcel {Janda}", title="REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD", booktitle="22nd SVSFEM ANSYS Users' Group Meeting and Conference 2014", year="2014", number="1", pages="114--118", address="Jasná, Slovak Republic", isbn="978-80-905525-1-7" }