Publication detail

Bonding of zero-shrink LTCC with alumina ceramics

SOMER, J. ŠTEKOVIČ, M. URBAN, F. ŠANDERA, J. SZENDIUCH, I.

Original Title

Bonding of zero-shrink LTCC with alumina ceramics

Type

journal article in Web of Science

Language

English

Original Abstract

Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates it is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging. This paper is focused on a description of reliable bonding technique of zero-shrink LTCC and alumina ceramics.

Keywords

low temperature co-fired ceramics (LTCC), Alumina Ceramics, thick film pastes, Cold Chemical Lamination

Authors

SOMER, J.; ŠTEKOVIČ, M.; URBAN, F.; ŠANDERA, J.; SZENDIUCH, I.

RIV year

2015

Released

4. 8. 2015

Publisher

Emerald Group Publishing Limited

ISBN

0954-0911

Periodical

SOLDERING & SURFACE MOUNT TECHNOLOGY

Year of study

27

Number

4

State

United Kingdom of Great Britain and Northern Ireland

Pages from

157

Pages to

163

Pages count

7

URL

http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-10-2014-0021

BibTex

@article{BUT115431,
  author="Jakub {Somer} and Michal {Štekovič} and František {Urban} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Bonding of zero-shrink LTCC with alumina ceramics",
  journal="SOLDERING & SURFACE MOUNT TECHNOLOGY",
  year="2015",
  volume="27",
  number="4",
  pages="157--163",
  doi="10.1108/SSMT-10-2014-0021",
  issn="0954-0911",
  url="http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-10-2014-0021"
}