Publication detail

ANALYSIS AND PREDICTION OF RELIABILITY OF SOLDER JOINTS

NOVOTNÝ, V. ŠANDERA, J.

Original Title

ANALYSIS AND PREDICTION OF RELIABILITY OF SOLDER JOINTS

Type

conference paper

Language

English

Original Abstract

This arcticle deals with the sphere of solder joints reliability and narrower focus is using simulation software ANSYS and fatigue models for estimate reliability of solder joints. The text describes the introduction to the issue of the reliability of soldered connections and important factors with their influences. Then are described some options for prediction of reliability. This includes the issue of fatigue models and design of simulation in simulating software ANSYS. In conclusion, there are described outputs of simulations and options for calculation by fatigue models.

Keywords

EEICT, ANSYS, reliability, simulation, solder joints, fatigue models

Authors

NOVOTNÝ, V.; ŠANDERA, J.

RIV year

2015

Released

23. 4. 2015

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Location

Brno

ISBN

978-80-214-5148-3

Book

Proceedings of the 21st Conference STUDENT EEICT 2015

Edition

1

Edition number

1

ISBN

NEUVEDENO

Pages from

381

Pages to

385

Pages count

5

BibTex

@inproceedings{BUT115512,
  author="Václav {Novotný} and Josef {Šandera}",
  title="ANALYSIS AND PREDICTION OF RELIABILITY OF SOLDER JOINTS",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015",
  year="2015",
  series="1",
  number="1",
  pages="381--385",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5148-3"
}