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ŘIHÁK, P. VALA, R. SZENDIUCH, I.
Original Title
Detection of Defects on BGA Solder Balls Using 2D and 3D Methods
Type
conference paper
Language
English
Original Abstract
The paper is focused on non-destructive X-Ray method used for detection of defects on BGA solder balls. It is possible to use 2D or 3D methods with imaging of individual layers. 2D method is faster and it is used in daily basis. 3D method is less common and it is used for unique defects for further examination. This paper deals with using these methods especially throughout rework process.
Keywords
X-Ray, BGA, defects, detection
Authors
ŘIHÁK, P.; VALA, R.; SZENDIUCH, I.
RIV year
2015
Released
6. 5. 2015
Publisher
Budapest University of Technology and Economics
Location
Hungary
ISBN
978-963-313-177-0
Book
Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology
Pages from
245
Pages to
249
Pages count
5
URL
https://ieeexplore.ieee.org/document/7247999
BibTex
@inproceedings{BUT117450, author="Pavel {Řihák} and Radek {Vala} and Ivan {Szendiuch}", title="Detection of Defects on BGA Solder Balls Using 2D and 3D Methods", booktitle="Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology", year="2015", pages="245--249", publisher="Budapest University of Technology and Economics", address="Hungary", doi="10.1109/ISSE.2015.7247999", isbn="978-963-313-177-0", url="https://ieeexplore.ieee.org/document/7247999" }