Přístupnostní navigace
E-application
Search Search Close
Publication detail
ČEKAN, O. PODIVÍNSKÝ, J. KOTÁSEK, Z.
Original Title
Software Fault Tolerance: the Evaluation by Functional Verification
Type
conference paper
Language
English
Original Abstract
The aim of this paper is to present a new approach in evaluating Software Fault Tolerance (SFT) methodologies. It is the way on how to ensure fault tolerance without any additional hardware as is common in frequently used Triple Modular Redundancy (TMR). As our research is focused on electromechanical systems which are commonly driven by processors or Multi Processors Systems on Chip (MPSoC) we decided to use the soft-core processor running on Field Programmable Gate Array (FPGA) as our experimental platform. The new approach uses Functional Verification for automation of the evaluation process. The functional verification environment is one of the important parts of the presented evaluation platform architecture. Programs generation for a processor, where SFT is applied, is also important. Experiments with the programs generator and fault injection are presented and goals for future work are identified on that basis.
Keywords
Software Fault Tolerance SFT Processor Fault Injection Electro-mechanical Systems Functional Verification
Authors
ČEKAN, O.; PODIVÍNSKÝ, J.; KOTÁSEK, Z.
RIV year
2015
Released
26. 8. 2015
Publisher
IEEE Computer Society
Location
Funchal
ISBN
978-1-4673-8035-5
Book
Proceedings of the 18th Euromicro Conference on Digital Systems Design
Pages from
284
Pages to
287
Pages count
4
URL
https://ieeexplore.ieee.org/document/7302285
BibTex
@inproceedings{BUT119910, author="Ondřej {Čekan} and Jakub {Podivínský} and Zdeněk {Kotásek}", title="Software Fault Tolerance: the Evaluation by Functional Verification", booktitle="Proceedings of the 18th Euromicro Conference on Digital Systems Design", year="2015", pages="284--287", publisher="IEEE Computer Society", address="Funchal", doi="10.1109/DSD.2015.107", isbn="978-1-4673-8035-5", url="https://ieeexplore.ieee.org/document/7302285" }