Publication detail

The Evaluation Platform for Testing Fault-Tolerance Methodologies in Electro-mechanical Applications

PODIVÍNSKÝ, J. ČEKAN, O. ZACHARIÁŠOVÁ, M. KOTÁSEK, Z.

Original Title

The Evaluation Platform for Testing Fault-Tolerance Methodologies in Electro-mechanical Applications

Type

journal article in Web of Science

Language

English

Original Abstract

The aim of this paper is to present a new platform for estimating the fault-tolerance quality of electro-mechanical applications based on FPGAs. We demonstrate one working example of such EM application that was evaluated using our platform: the mechanical robot and its electronic controller in an FPGA. Different building blocks of the electronic robot controller allow to model different effects of faults on the whole mission of the robot (searching a path in a maze). In the experiments, the mechanical robot is simulated in the simulation environment, where the effects of faults injected into its controller can be seen. In this way, it is possible to differentiate between the fault that causes the failure of the system and the fault that only decreases the performance. Further extensions of the platform focus on the interconnection of the platform with the functional verification environment working directly in FPGA that allows automation and speed-up of checking the correctness of the system after the injection of faults.

Keywords

Fault Tolerance, Electro-mechanical Systems, Fault Injection, Single Event Upset, Functional verification

Authors

PODIVÍNSKÝ, J.; ČEKAN, O.; ZACHARIÁŠOVÁ, M.; KOTÁSEK, Z.

RIV year

2015

Released

30. 11. 2015

ISBN

0141-9331

Periodical

Microprocessors and Microsystems

Year of study

39

Number

8

State

Kingdom of the Netherlands

Pages from

1215

Pages to

1230

Pages count

16

URL

BibTex

@article{BUT119932,
  author="Jakub {Podivínský} and Ondřej {Čekan} and Marcela {Zachariášová} and Zdeněk {Kotásek}",
  title="The Evaluation Platform for Testing Fault-Tolerance Methodologies in Electro-mechanical Applications",
  journal="Microprocessors and Microsystems",
  year="2015",
  volume="39",
  number="8",
  pages="1215--1230",
  doi="10.1016/j.micpro.2015.05.011",
  issn="0141-9331",
  url="http://www.sciencedirect.com/science/article/pii/S0141933115000630"
}