Publication detail

Design and Numerical Modeling of Metal-Dielectric Resonant Structures for Infrared Band

NEŠPOR, D. DREXLER, P. KADLEC, R. GESCHEIDTOVÁ, E.

Original Title

Design and Numerical Modeling of Metal-Dielectric Resonant Structures for Infrared Band

Type

conference paper

Language

English

Original Abstract

The article presents results of numerical modelling of planar resonators arrays deigned for THz frequencies. The increase in the resonant frequency of each array’s element is achieved by down-scalling its dimensions. Accompanying effects, as the rise of resistive metal losses are examined also. The presented results have shown the possibilities of down-scalling the geometry of basic planar resonators in order to achieve the resonance phenomena at THz frequencies, eventually in the infrared band.

Keywords

metamaterial, planar resonator, THz band, infrared band, numerical simulation

Authors

NEŠPOR, D.; DREXLER, P.; KADLEC, R.; GESCHEIDTOVÁ, E.

Released

18. 4. 2016

Publisher

Department of Electronics and Multimedia Communications,Faculty of Electrical Engineering and Informatics, Technical University of Košice

Location

Košice

ISBN

978-1-5090-1673-0

Book

Proceedings of the 26th International Conference RADIOELEKTRONIKA 2016 April 19-20, 2016, Košice, Slovakia

Pages from

458

Pages to

463

Pages count

6

URL

https://ieeexplore.ieee.org/document/7477405

BibTex

@inproceedings{BUT124126,
  author="Dušan {Nešpor} and Petr {Drexler} and Radim {Kadlec} and Eva {Gescheidtová}",
  title="Design and Numerical Modeling of Metal-Dielectric Resonant Structures for Infrared Band",
  booktitle="Proceedings of the 26th International Conference RADIOELEKTRONIKA 2016
April 19-20, 2016, Košice, Slovakia
",
  year="2016",
  pages="458--463",
  publisher="Department of Electronics and Multimedia Communications,Faculty of Electrical Engineering and Informatics, Technical University of Košice",
  address="Košice",
  doi="10.1109/RADIOELEK.2016.7477405",
  isbn="978-1-5090-1673-0",
  url="https://ieeexplore.ieee.org/document/7477405"
}