Publication detail

Electrothermal simulation of bonding wire degradation under uncertain geometries

CASPER, T. DE GERSEM, H. GILLON, R. GÖTTHANS, T. KRATOCHVÍL, T. SCHÖPS, S.

Original Title

Electrothermal simulation of bonding wire degradation under uncertain geometries

Type

conference paper

Language

English

Original Abstract

In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with respect to thermal degradation is investigated. Instead of resolving the wires by the computational grid, lumped element representations are introduced as point-to-point connections in the spatially distributed model. Fabrication tolerances lead to uncertainties of the wires' parameters and influence the operation and reliability of the final product. Based on geometric measurements, the resulting variability of the wire temperatures is determined using the stochastic electrothermal field-circuit model.

Keywords

Bonding; Computational modeling; Couplings; Heating; Mathematical model; Thermal conductivity; Wires

Authors

CASPER, T.; DE GERSEM, H.; GILLON, R.; GÖTTHANS, T.; KRATOCHVÍL, T.; SCHÖPS, S.

Released

14. 3. 2016

Publisher

IEEE

Location

Dresden, Germany

ISBN

978-3-9815370-6-2

Book

2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)

Pages from

1297

Pages to

1302

Pages count

6

URL

https://ieeexplore.ieee.org/document/7459510

BibTex

@inproceedings{BUT124488,
  author="Thorben {Casper} and Herbert {De Gersem} and Renaud {Gillon} and Tomáš {Götthans} and Tomáš {Kratochvíl} and Sebastian {Schöps}",
  title="Electrothermal simulation of bonding wire degradation under uncertain geometries",
  booktitle="2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)",
  year="2016",
  pages="1297--1302",
  publisher="IEEE",
  address="Dresden, Germany",
  isbn="978-3-9815370-6-2",
  url="https://ieeexplore.ieee.org/document/7459510"
}