Publication detail

Investigation of Creep and Stress Relaxation of Lead-free Solder Joints

SZENDIUCH, I.

Original Title

Investigation of Creep and Stress Relaxation of Lead-free Solder Joints

Type

conference paper

Language

English

Original Abstract

Investigation of lead-free solders by mechanical tests (creep and stress). Comparation of SnAg, SnAgCu with SnPb.

Key words in English

lead free soldering, ageing, reliability

Authors

SZENDIUCH, I.

RIV year

2004

Released

14. 11. 2004

Publisher

IMAPS USA

Location

Long Beach

ISBN

0-930815-74-2

Book

37th IMAPS Symposium on Microelectronics

Edition number

první

Pages from

1-10

Pages count

10