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STARÝ, J., KAZELLE, J.
Original Title
Solder Wetting of Substrate Surface in Lead Free Soldering
Type
conference paper
Language
English
Original Abstract
Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis on different substrates
Keywords
lead free, wetting, surface finish, substrate, flux
Authors
RIV year
2004
Released
16. 6. 2004
Publisher
VUT v Brně
Location
Brno
ISBN
80-214-2701-9
Book
The 11th Electronic Devices and Systems Conference
Pages from
394
Pages to
398
Pages count
5
BibTex
@inproceedings{BUT12620, author="Jiří {Starý} and Jiří {Kazelle}", title="Solder Wetting of Substrate Surface in Lead Free Soldering", booktitle="The 11th Electronic Devices and Systems Conference", year="2004", pages="5", publisher="VUT v Brně", address="Brno", isbn="80-214-2701-9" }