Publication detail

Solder Wetting of Substrate Surface in Lead Free Soldering

STARÝ, J., KAZELLE, J.

Original Title

Solder Wetting of Substrate Surface in Lead Free Soldering

Type

conference paper

Language

English

Original Abstract

Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis on different substrates

Keywords

lead free, wetting, surface finish, substrate, flux

Authors

STARÝ, J., KAZELLE, J.

RIV year

2004

Released

16. 6. 2004

Publisher

VUT v Brně

Location

Brno

ISBN

80-214-2701-9

Book

The 11th Electronic Devices and Systems Conference

Pages from

394

Pages to

398

Pages count

5

BibTex

@inproceedings{BUT12620,
  author="Jiří {Starý} and Jiří {Kazelle}",
  title="Solder Wetting of Substrate Surface in Lead Free Soldering",
  booktitle="The 11th Electronic Devices and Systems Conference",
  year="2004",
  pages="5",
  publisher="VUT v Brně",
  address="Brno",
  isbn="80-214-2701-9"
}