Publication detail

ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS

VALA, R. TOUFAR, M.

Original Title

ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS

English Title

ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS

Type

conference paper

Language

Czech

Original Abstract

This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.

English abstract

This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.

Keywords

BGA, flux, solder, repair

Key words in English

BGA, flux, solder, repair

Authors

VALA, R.; TOUFAR, M.

Released

28. 4. 2016

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Location

Brno

ISBN

978-80-214-5350-0

Book

Proceedings of the 22nd Conference Student EEICT 2016

Pages from

203

Pages to

205

Pages count

777

BibTex

@inproceedings{BUT127136,
  author="Radek {Vala} and Michal {Toufar}",
  title="ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS",
  booktitle="Proceedings of the 22nd Conference Student EEICT 2016",
  year="2016",
  pages="203--205",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5350-0"
}