Publication detail

FR4 – Ceramic „Z“ Axis Solder Joint Reliability

ŠANDERA, J.

Original Title

FR4 – Ceramic „Z“ Axis Solder Joint Reliability

Type

conference paper

Language

English

Original Abstract

3D packaging system is described in this paper

Keywords

3D, packacig, ceramic and laminate connection

Authors

ŠANDERA, J.

RIV year

2004

Released

16. 6. 2004

Publisher

IMAPS CZ&SK

Location

Praha

ISBN

80-239-2835-X

Book

Proceedings of 3rd European Microelectronics and Packaging Symposium

Edition number

první

Pages from

687

Pages to

694

Pages count

8

BibTex

@inproceedings{BUT12998,
  author="Josef {Šandera}",
  title="FR4 – Ceramic „Z“ Axis Solder Joint Reliability",
  booktitle="Proceedings of 3rd European Microelectronics and Packaging Symposium",
  year="2004",
  number="první",
  pages="8",
  publisher="IMAPS CZ&SK",
  address="Praha",
  isbn="80-239-2835-X"
}