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SOBEK, J. FRANTÍK, P. VESELÝ, V.
Original Title
Analytical approximation of crack-tip stress field: Study on efficient determination of coefficients of higher order terms of Williams power expansion
Type
conference paper
Language
English
Original Abstract
The paper presents a study on accuracy of the multi-parameter approximation of the stress field in a cracked body using Williams power series calibrated according to results of FEM computation. Main attention is paid to a detailed analysis of suitable selection of FE nodes, whose results serve as inputs to the over-deterministic method (ODM) employed for determination of the coefficients of terms of the Williams expansion describing the crack-tip field. Two different ways of FE nodal selection are compared – nodes selected from the crack tip vicinity versus nodes selected from a specific part of the test specimen body in a specific way. Comparison is made with the usage of the authors’ own developed procedures enabling both the determination of the coefficients of the analytical approximation of stress field based on the FE results and the backward reconstruction of the field from those determined terms’ coefficients/functions. The wedge-splitting test (WST) specimen with a crack is taken as example for the study
Keywords
Multi-parameter fracture mechanics, Williams expansion, over-deterministic method
Authors
SOBEK, J.; FRANTÍK, P.; VESELÝ, V.
Released
18. 8. 2016
Publisher
Trans Tech Publications
Location
Switzerland
ISBN
1013-9826
Periodical
Key Engineering Materials (print)
Year of study
713
State
Swiss Confederation
Pages from
207
Pages to
211
Pages count
5
BibTex
@inproceedings{BUT130323, author="Jakub {Sobek} and Petr {Frantík} and Václav {Veselý}", title="Analytical approximation of crack-tip stress field: Study on efficient determination of coefficients of higher order terms of Williams power expansion", booktitle="Advances in Fracture and Damage Mechanics XV", year="2016", journal="Key Engineering Materials (print)", volume="713", pages="207--211", publisher="Trans Tech Publications", address="Switzerland", doi="10.4028/www.scientific.net/KEM.713.207", issn="1013-9826" }