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MOJROVÁ, B. MIHAILETCHI, V. CHU, H. COMPAROTTO, C. THEOBALD, J. KOPECEK, R.
Original Title
Screen Printed Metallization on p+ Emitters of n-Type Silicon Solar Cells
Type
conference paper
Language
English
Original Abstract
In this study we designed and fabricated n-PERT (Passivated Emitter, Rear Totally Diffused) solar cells and we investigated the effect of different boron emitter profiles (emitter surface concentration and emitter junction depth) on the cell performance. The emitter was varying in the depth demitter and the peak surface carrier concentration NA, and so the resulting sheet resistance RSh was changing between 60 Ω/sq and 140 Ω/sq. The value of RSh of Back Surface Field (BSF) layer was 75 Ω/sq in all cases. We metalized boron emitters by a commercial firing- through AgAl paste or a pure Ag paste and we varied the metallization fraction to extract the recombination current density J0-met under the metal contact for each emitter/paste.
Keywords
solar cell, metallization, n-type
Authors
MOJROVÁ, B.; MIHAILETCHI, V.; CHU, H.; COMPAROTTO, C.; THEOBALD, J.; KOPECEK, R.
Released
3. 11. 2016
ISBN
9788021454163
Book
Imaps Flash Conference
Pages from
1
Pages to
5
Pages count
BibTex
@inproceedings{BUT130857, author="Barbora {Mojrová} and Valentin {Mihailetchi} and Haifeng {Chu} and Corrado {Comparotto} and Jens {Theobald} and Radovan {Kopecek}", title="Screen Printed Metallization on p+ Emitters of n-Type Silicon Solar Cells", booktitle="Imaps Flash Conference", year="2016", pages="1--5", isbn="9788021454163" }