Publication detail

Cement based heat-insulating materials for use in floor constructions

MIKULICA, K. HÁJKOVÁ, I. HUBÁČEK, A.

Original Title

Cement based heat-insulating materials for use in floor constructions

Type

conference paper

Language

English

Original Abstract

Many architects, designers and builders struggle with the ongoing problem of how to fill the space between the load bearing foundations / ceiling land the flooring structure in the easiest and cheapest way while still retaining the optimum heating and sound insulating properties. In this age of hi-tech and plentiful amounts of construction materials, it is very difficult to focus on the market. On paper, very similar products from natural or artificially produced materials can be delivered to the construction site in a hardened state, most frequently in the form of boards or granulate or produced directly on-site or near a concrete plant and transported to for placement in a liquid state. This areas does concerns both new residential or industrial objects, as we as old objects which are waiting for reconstruction. [1] During the project solution, various mixtures were designed that use the cement mortar and filler as a binder in the form of technical foam, expanded clay, vermiculite, perlite and hemp shives, so that when fresh the density does not exceed 1.400 kg / m3 and the materials can then be used as heat-insulating material in the flooring construction. [2]

Keywords

Foamconcrete, lightweight concrete, thermal conductivity coefficient λ.

Authors

MIKULICA, K.; HÁJKOVÁ, I.; HUBÁČEK, A.

Released

11. 8. 2016

Publisher

Trans Tech Publications

Location

Switzerland

ISBN

1662-9752

Periodical

Materials Science Forum

Number

865

State

Swiss Confederation

Pages from

224

Pages to

228

Pages count

5

URL

https://www.scientific.net/MSF.865.224.pdf

BibTex

@inproceedings{BUT133311,
  author="Karel {Mikulica} and Iveta {Tuscher Hájková} and Adam {Hubáček}",
  title="Cement based heat-insulating materials for use in floor constructions",
  booktitle="Materials Science Forum",
  year="2016",
  journal="Materials Science Forum",
  number="865",
  pages="224--228",
  publisher="Trans Tech Publications",
  address="Switzerland",
  doi="10.4028/www.scientific.net/MSF.865.224",
  issn="1662-9752",
  url="https://www.scientific.net/MSF.865.224.pdf"
}