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LYČKA L. ŠTĚPÁNEK P.
Original Title
Strut-And-Tie Model for Predicting the Punching Shear of Flat Slabs with Shear Reinforcement
Type
conference paper
Language
English
Original Abstract
The purpose of this paper is to describe a framework of the proposed method for predicting the punching shear of flat slabs with shear reinforcement. The proposed method is based on a strut-and-tie model. Current methods of predicting the punching shear strength of flat slabs could be divided into these categories: models based on empirical equations, physical models, analytical methods and finite element methods. Most of the current codes in force would be best described as empirical formulations. Physical model for prediction of punching shear is described in Model Code 2010. Proposed method for flat slabs with shear reinforcement is based mainly on a strut-and-tie model and therefore could be considered as an analytical method.For the purpose of demonstrating the effectiveness of the proposed method, the method is compared with some of the main methods currently in use, such as Eurocode EC2, American code ACI 318 and Model Code 2010. The comparison consists of results of more than 98 experiments of punching shear on the flat slabs with shear reinforcement, gathered from publications from all around the world.
Keywords
Punching Shear; Flat Slab; Strut-and-Tie
Authors
LYČKA L.; ŠTĚPÁNEK P.
Released
19. 5. 2017
Publisher
Trans Tech Publications, Switzerland
Location
Switzerland
ISBN
978-3-0357-1105-9
Book
23rd International Conference on Concrete Days, 2016
1662-9779
Periodical
Solid State Phenomena
Year of study
259
State
Swiss Confederation
Pages from
178
Pages to
183
Pages count
6
URL
https://www.scientific.net/SSP.259.178
BibTex
@inproceedings{BUT133614, author="Lukáš {Lyčka} and Petr {Štěpánek}", title="Strut-And-Tie Model for Predicting the Punching Shear of Flat Slabs with Shear Reinforcement", booktitle="23rd International Conference on Concrete Days, 2016 ", year="2017", journal="Solid State Phenomena", volume="259", pages="178--183", publisher="Trans Tech Publications, Switzerland", address="Switzerland", doi="10.4028/www.scientific.net/SSP.259.178", isbn="978-3-0357-1105-9", issn="1662-9779", url="https://www.scientific.net/SSP.259.178" }