Publication detail

The Use of Microstructural Analysis for the Evaluation of Quality of Double-Wall Pipes

KLAKURKOVÁ, L. JULIŠ, M. GEJDOŠ, P. HORYNOVÁ, M.

Original Title

The Use of Microstructural Analysis for the Evaluation of Quality of Double-Wall Pipes

Type

conference paper

Language

English

Original Abstract

This contribution is based on case studies concerning failure of double-wall pipes due to several factors. Series of double wall-pipes from different suppliers were studied using light and electron microscopy in order to reveal defects which led to the failure of each set of the pipes. Pipes, made of combination of steel and copper were analysed in the initial state and after heat treatment. Heat treatment, was performed by the suppliers, not further specified, and varied between suppliers [1, 2]. Metallographic analysis revealed unsuitable microstructure of steel layers and heterogeneity in Cu layer. More detailed analysis revealed precipitation of Cu-based phase on the Cu-steel interface resulting from heat treatment process, but for one set of tubes, precipitates were observed even in the initial state, probably due to higher temperatures used during the fabrication process, see Fig. 1. Based on the findings, optimization of heat treatment was suggested and one of the suppliers was recommended.

Keywords

heat treatment; steel; copper;, light microscopy; electron microscopy

Authors

KLAKURKOVÁ, L.; JULIŠ, M.; GEJDOŠ, P.; HORYNOVÁ, M.

Released

1. 1. 2017

Publisher

Trans Tech Publications Ltd.

Location

Switzerland

ISBN

978-3-0357-1018-2

Book

Metallography XVI

Edition number

1

ISBN

0255-5476

Periodical

Materials Science Forum

State

Swiss Confederation

Pages from

269

Pages to

273

Pages count

5

URL

BibTex

@inproceedings{BUT133973,
  author="Lenka {Klakurková} and Martin {Juliš} and Pavel {Gejdoš} and Miroslava {Horynová}",
  title="The Use of Microstructural Analysis for the Evaluation of Quality of Double-Wall Pipes",
  booktitle="Metallography XVI",
  year="2017",
  journal="Materials Science Forum",
  number="1",
  pages="269--273",
  publisher="Trans Tech Publications Ltd.",
  address="Switzerland",
  doi="10.4028/www.scientificnet/MSF.891.269",
  isbn="978-3-0357-1018-2",
  issn="0255-5476",
  url="http://www.scientificnet/MSF.891.269"
}