Publication detail

Study of Influence of Residual Stresses on Crack Propagation in Particulate Ceramic Composites

MAJER, Z. NÁHLÍK, L. ŠTEGNEROVÁ, K. HUTAŘ, P. BERMEJO, R.

Original Title

Study of Influence of Residual Stresses on Crack Propagation in Particulate Ceramic Composites

Type

conference paper

Language

English

Original Abstract

The aim of the present work is to analyze the influence of residual stresses in the particulate ceramic composite on the crack propagation. The crack propagation direction was estimated using Sih’s criterion based on the strain energy density factor. A two-dimensional finite element model was developed for determination of crack path. The residual stresses resulting from the mismatch of coefficients of thermal expansion during the fabrication process of the composite were implemented to the computational model. The effect of the particles shape on the crack propagation was investigated. Conclusions of this paper can contribute to a better understanding of the propagation of micro-cracks in particulate composites in the field of residual stresses.

Keywords

residual stresses, particulate ceramic composite, crack propagation, shielding effect

Authors

MAJER, Z.; NÁHLÍK, L.; ŠTEGNEROVÁ, K.; HUTAŘ, P.; BERMEJO, R.

Released

2. 1. 2017

Publisher

Trans Tech Publications Inc.

Location

Zürrich, Switzerland

ISBN

978-3-03835-626-4

Book

MSMF8. International Conference on Materials Structure and Micromechanics of Fracture

Edition

8

ISBN

1662-9779

Periodical

Solid State Phenomena

Number

258

State

Swiss Confederation

Pages from

178

Pages to

181

Pages count

4

URL

https://www.scientific.net/SSP.258.178

BibTex

@inproceedings{BUT141076,
  author="Zdeněk {Majer} and Luboš {Náhlík} and Kateřina {Štegnerová} and Pavel {Hutař} and Raul {Bermejo}",
  title="Study of Influence of Residual Stresses on Crack Propagation in Particulate Ceramic Composites",
  booktitle="MSMF8. International Conference on Materials Structure and Micromechanics of Fracture",
  year="2017",
  series="8",
  journal="Solid State Phenomena",
  number="258",
  pages="178--181",
  publisher="Trans Tech Publications Inc.",
  address="Zürrich, Switzerland",
  doi="10.4028/www.scientific.net/SSP.258.178",
  isbn="978-3-03835-626-4",
  issn="1662-9779",
  url="https://www.scientific.net/SSP.258.178"
}