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PLICHTA, T. ČECH, V. HEGEMANN, D.
Original Title
Adhesion evaluation of a-SiC:H thin films on silicon wafers using the nanoscratch testing technique
Type
abstract
Language
English
Original Abstract
Scratch testing is the most commonly technique for assessing the adhesion of thin films to the substrates and determining its application possibilities. Planar silicon wafers were pretreated with argon plasma using continuous wave for 10 min to clean the surface from adsorbed gases and reach reproducible adhesion of films. Thin films of hydrogenated amorphous carbon-silicon (a-SiC:H) were deposited from tetravinylsilane (TVS) monomer (pulsed plasma with effective power in range 2 – 150 W) on wafers by plasma enhanced chemical vapor deposition (PECVD). Films of 0.1 μm thickness were tested by scratch test using a conical diamond tip (radius of 1 μm) with the peak load up to 10mN and using 10 μm scratch length. Good reproducibility of the film adhesion was found for the individual depositions. No significant effect of loading rate ranging from 4 to 20 mN/min was observed. We revealed that the critical load increased with enhanced power from 1.6mN (2 W) up to 4.6mN (75 W) and was invariable for higher power 4.4mN (150 W). The measurement showed a linear increase in critical normal force in dependence on thickness. Excellent adhesion of the films for 1100 days was observed, with no aging effects.
Keywords
Nanoscratch test, Thin films, Adhesion, PECVD
Authors
PLICHTA, T.; ČECH, V.; HEGEMANN, D.
Released
13. 11. 2017
Publisher
ADAG PRINT
Location
Zürich, Switzerland
Pages from
76
Pages to
Pages count
88
URL
https://www.empa.ch/web/s606/phd-symposium-2017
BibTex
@misc{BUT141332, author="PLICHTA, T. and ČECH, V. and HEGEMANN, D.", title="Adhesion evaluation of a-SiC:H thin films on silicon wafers using the nanoscratch testing technique", year="2017", pages="76--76", publisher="ADAG PRINT", address="Zürich, Switzerland", url="https://www.empa.ch/web/s606/phd-symposium-2017", note="abstract" }