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NÁHLÍK, L. MAJER, Z. ŠTEGNEROVÁ, K. HUTAŘ, P.
Original Title
Lifetime Assessment of Particulate Ceramic Composite with Residual Stresses
Type
conference paper
Language
English
Original Abstract
A micro-crack propagation in particulate ceramic based composite was studied using finite element method (FEM). Subcritical crack growth (SCG) was numerically simulated under complex load conditions (mechanical loading and loading by internal residual stresses). The effect of residual stresses on the crack propagation was studied. Two-dimensional computational model of particulate ceramic composite with material properties corresponding to low temperature co-fired ceramics (LTCC) was developed. The results indicate that the presence of residual stresses significantly reduces values of stress intensity factor in the vicinity of composite surface and the direction of residual stresses around the particles contributes to the micro-crack deflection from the particles. The time to failure of the composite under mechanical loading was determined. Results obtained contribute to a better understanding of the role of residual stresses during micro-crack propagation in ceramic particulate composites.
Keywords
Ceramic Particulate Composite, Residual Stress, Sub-Critical Crack Growth
Authors
NÁHLÍK, L.; MAJER, Z.; ŠTEGNEROVÁ, K.; HUTAŘ, P.
Released
2. 1. 2018
Publisher
Trans Tech Publications Inc.
Location
Zürrich, Switzerland
ISBN
978-3-0357-1168-4
Book
Advances in Fracture and Damage Mechanics XVI
1662-9795
Periodical
Key Engineering Materials (web)
Year of study
754
Number
1
State
Swiss Confederation
Pages from
107
Pages to
110
Pages count
4
URL
https://www.scientific.net/KEM.754.107
BibTex
@inproceedings{BUT141409, author="Luboš {Náhlík} and Zdeněk {Majer} and Kateřina {Štegnerová} and Pavel {Hutař}", title="Lifetime Assessment of Particulate Ceramic Composite with Residual Stresses", booktitle="Advances in Fracture and Damage Mechanics XVI", year="2018", journal="Key Engineering Materials (web)", volume="754", number="1", pages="107--110", publisher="Trans Tech Publications Inc.", address="Zürrich, Switzerland", doi="10.4028/www.scientific.net/KEM.754.107", isbn="978-3-0357-1168-4", issn="1662-9795", url="https://www.scientific.net/KEM.754.107" }