Publication detail

3D Model of Crack Propagation in Particulate Ceramic Composite Containing Residual Stresses

ŠTEGNEROVÁ, K. MAJER, Z. HUTAŘ, P. NÁHLÍK, L.

Original Title

3D Model of Crack Propagation in Particulate Ceramic Composite Containing Residual Stresses

Type

conference paper

Language

English

Original Abstract

A crack propagation and fracture behaviour of particulate ceramic composite were investigated. Influence of 3D shape of particles on the crack propagation was studied together with influence of the presence of residual stresses, which are developed inside the composite during manufacturing process. Finite element (FE) method was used for numerical simulation of propagating crack in the composite. Basic numerical models of low-temperature co-fired ceramics (LTCC) with alumina particles homogenously dispersed in the glass matrix were developed. Volume fraction of alumina phase was 20vol.%, which is typical amount for LTCC. The results show that existence of residual stresses retards the crack propagating under conditions of sub-critical crack growth (SCG). Presented results contribute to a better understanding of the role of residual stresses in particulate ceramic composites.

Keywords

Ceramic Particulate Composite, Residual Stress, Sub-Critical Crack Growth

Authors

ŠTEGNEROVÁ, K.; MAJER, Z.; HUTAŘ, P.; NÁHLÍK, L.

Released

2. 1. 2018

Publisher

Trans Tech Publications Inc.

Location

Zürrich, Switzerland

ISBN

9783035713503

Book

Advances in Fracture and Damage Mechanics XVI

ISBN

1013-9826

Periodical

Key Engineering Materials (print)

Year of study

754

Number

1

State

Swiss Confederation

Pages from

103

Pages to

106

Pages count

4

URL

https://www.scientific.net/KEM.754.103

BibTex

@inproceedings{BUT141450,
  author="Kateřina {Štegnerová} and Zdeněk {Majer} and Pavel {Hutař} and Luboš {Náhlík}",
  title="3D Model of Crack Propagation in Particulate Ceramic Composite Containing Residual Stresses",
  booktitle="Advances in Fracture and Damage Mechanics XVI",
  year="2018",
  journal="Key Engineering Materials (print)",
  volume="754",
  number="1",
  pages="103--106",
  publisher="Trans Tech Publications Inc.",
  address="Zürrich, Switzerland",
  doi="10.4028/www.scientific.net/KEM.754.103",
  isbn="9783035713503",
  issn="1013-9826",
  url="https://www.scientific.net/KEM.754.103"
}