Přístupnostní navigace
E-application
Search Search Close
Publication detail
CUI, J. L. KANETA, M. YANG, P. YANG, P. R.
Original Title
The Relation Between Thermal Wedge and Thermal Boundary Conditions for the Load-Carrying Capacity of a Rectangular Pad and a Slider With Parallel Gaps
Type
journal article in Web of Science
Language
English
Original Abstract
In order to understand the load-carrying mechanism of thermal wedge, numerical results for a rectangular pad and a slider with parallel gaps under four types of surface boundary temperature conditions are presented. Two assumptions of rigid-solid and smooth-surface were used to exclude the effects of both thermal deformation and micro-asperity. The relation between thermal wedge and thermal boundary conditions is revealed. The load-carrying mechanism of parallel gaps is explained with the thermal wedge derived not only from the surface temperature difference (STD) as proposed by Cameron but also from the film temperature gradient (FTG) independent of STD. It is also pointed out that in numerical analysis, the very small viscosity-temperature coefficient would result in high oil temperature and therefore, the predicted loading capacity from thermal density wedge would be extremely enlarged.
Keywords
Rectangular pad; parallel gap; load-carrying mechanism; thermal wedge; film temperature gradient.
Authors
CUI, J. L.; KANETA, M.; YANG, P.; YANG, P. R.
Released
11. 4. 2016
Publisher
ASME
Location
NEW YORK, USA
ISBN
0742-4787
Periodical
ASME Transaction, Journal of Tribology
Year of study
138
Number
2
State
United States of America
Pages from
1
Pages to
6
Pages count
BibTex
@article{BUT143484, author="CUI, J. L. and KANETA, M. and YANG, P. and YANG, P. R.", title="The Relation Between Thermal Wedge and Thermal Boundary Conditions for the Load-Carrying Capacity of a Rectangular Pad and a Slider With Parallel Gaps", journal="ASME Transaction, Journal of Tribology", year="2016", volume="138", number="2", pages="1--6", doi="10.1115/1.4031515", issn="0742-4787" }