Publication detail

Application of the Williams Expansion near a Bi-Material Interface

MALÍKOVÁ, L. SEITL, S.

Original Title

Application of the Williams Expansion near a Bi-Material Interface

Type

conference paper

Language

English

Original Abstract

A simplified model of a crack approaching a bi-material interface is modelled by means of the finite element method in order to investigate the significance of the higher-order terms of the Williams expansion for the proper approximation of the opening crack-tip stress near the bi-material interface. The discussion on results is presented and the importance of the higher-order terms proved.

Keywords

Bi-material interface; Crack-tip stress distribution; Finite element; Over-deterministic method; Williams expansion

Authors

MALÍKOVÁ, L.; SEITL, S.

Released

1. 9. 2017

ISBN

1662-9795

Periodical

Key Engineering Materials (web)

Year of study

2017

Number

754

State

Swiss Confederation

Pages from

206

Pages to

209

Pages count

4

BibTex

@inproceedings{BUT146039,
  author="Lucie {Malíková} and Stanislav {Seitl}",
  title="Application of the Williams Expansion near a Bi-Material Interface",
  booktitle="Key Engineering Materials",
  year="2017",
  journal="Key Engineering Materials (web)",
  volume="2017",
  number="754",
  pages="206--209",
  doi="10.4028/www.scientific.net/KEM.754.206",
  issn="1662-9795"
}