Publication detail

Thermomechanical stressing of microelectronics structures

Novotný, M., Bulva, J., Szendiuch, I.

Original Title

Thermomechanical stressing of microelectronics structures

Type

conference paper

Language

English

Original Abstract

Termomechanical stressing microeletronics structure

Keywords

Stress, ANSYS, life time, strain

Authors

Novotný, M., Bulva, J., Szendiuch, I.

RIV year

2005

Released

1. 1. 2005

Publisher

IMAPS BENELUX

Location

Brugge

ISBN

00-000-0000-0

Book

Proceedings EMPC 2005

Edition number

první

Pages from

513

Pages to

516

Pages count

4

BibTex

@inproceedings{BUT14676,
  author="Marek {Novotný} and Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Thermomechanical stressing of microelectronics structures",
  booktitle="Proceedings EMPC 2005",
  year="2005",
  volume="1",
  number="první",
  pages="4",
  publisher="IMAPS BENELUX",
  address="Brugge",
  isbn="00-000-0000-0"
}