Publication detail

New Possible Way for Brazing of Thick Film Cermet Conductors

OTÁHAL, A. SKÁCEL, J. SZENDIUCH, I.

Original Title

New Possible Way for Brazing of Thick Film Cermet Conductors

Type

conference paper

Language

English

Original Abstract

The main aim of this work was to show a new approach in using brazing technology (hard soldering) on thick film conductors. Metallic leads and thick film conductors on alumina substrate were used to verify brazed joints. A flame and conductive heat transfer methods were used for brazing of three braze alloys such as Ag15CuP, Ag40Sn and Ag45CuZn. The tested pattern was made using silver (Ag) and silver-palladium (AgPd) thick film pastes on 96% Al2O3 substrate by screen printed technique and followed by firing process at temperature 850 °C. Nickel-silver and nickel-chromium-titanium leads were brazed on the thick film conductors with subsequent evaluation of the shear and the pull strength joints. The results of this work demonstrated very effective brazing technology on thick film conductors without usage of protective atmosphere or oven.

Keywords

Brazing, Thick films, Cermet, Resistance, Substrates, Conductors

Authors

OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.

Released

26. 8. 2019

Publisher

IEEE

ISBN

2161-2528

Periodical

Electronics Technology (ISSE)

State

United States of America

Pages from

1

Pages to

5

Pages count

5

URL

https://ieeexplore.ieee.org/document/8810246

BibTex

@inproceedings{BUT158362,
  author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch}",
  title="New Possible Way for Brazing of Thick Film Cermet Conductors",
  booktitle="42nd International Spring Seminar on Electronics Technology (ISSE)",
  year="2019",
  journal="Electronics Technology (ISSE)",
  pages="1--5",
  publisher="IEEE",
  doi="10.1109/ISSE.2019.8810246",
  issn="2161-2528",
  url="https://ieeexplore.ieee.org/document/8810246"
}