Publication detail

Measurements for RF Amplifiers, Bond Wire Fusing and MOS Power Cells

KRATOCHVÍL, T. PETRŽELA, J. ŠOTNER, R. DŘÍNOVSKÝ, J. GÖTTHANS, T. WIEERS, A. GILLON, R. REYNIER, P. POUPIN, Y.

Original Title

Measurements for RF Amplifiers, Bond Wire Fusing and MOS Power Cells

Type

book chapter

Language

English

Original Abstract

This chapter focuses on several areas regarding measurements (including methodology, test-bed development and measurement of results itself) of experimental results in the framework of an established cooperation with several partners from industry. We give attention to measurements for RF amplifiers, bond wire fusing and MOS power cells. We also include on-chip measurements of RF passive components and pay attention to heat, stress and reliability measurements. Measurements set-ups have been made in close cooperation with ON Semiconductor Belgium (Oudenaarde, Belgium) and with ACCO Semiconductor (Louveciennes, France).

Keywords

-

Authors

KRATOCHVÍL, T.; PETRŽELA, J.; ŠOTNER, R.; DŘÍNOVSKÝ, J.; GÖTTHANS, T.; WIEERS, A.; GILLON, R.; REYNIER, P.; POUPIN, Y.

Released

7. 11. 2019

Publisher

Springer

ISBN

978-3-030-30725-7

Book

Nanoelectronic Coupled Problems Solutions

Pages from

487

Pages to

515

Pages count

28

URL

BibTex

@inbook{BUT159842,
  author="Tomáš {Kratochvíl} and Jiří {Petržela} and Roman {Šotner} and Jiří {Dřínovský} and Tomáš {Götthans} and Aarnout {Wieers} and Renaud {Gillon} and Pascal {Reynier} and Yannick {Poupin}",
  title="Measurements for RF Amplifiers, Bond Wire Fusing and MOS Power Cells",
  booktitle="Nanoelectronic Coupled Problems Solutions",
  year="2019",
  publisher="Springer",
  pages="487--515",
  doi="10.1007/978-3-030-30726-4\{_}21",
  isbn="978-3-030-30725-7",
  url="https://link.springer.com/chapter/10.1007/978-3-030-30726-4_21"
}