Publication detail

Improving the Physical Security of Microchips

MALČÍK, D. DRAHANSKÝ, M.

Original Title

Improving the Physical Security of Microchips

Type

journal article in Web of Science

Language

English

Original Abstract

Nowadays, microchips are virtually everywhere, from simple home devices to confidential military equipment. We must not forget the medical systems that have a great impact on our quality of life as well. As can be seen, the importance of these tiny integrated circuits is immense. Preserving the reliability of these devices and the confidentiality of data these devices are processing is absolutely substantial. The integrated circuit (IC) industry has been rapidly evolving in recent decades and employing ICs is becoming normal and inevitable in nearly all aspects of our lives. The initial IC evolution era paid attention primarily to the technological evolution itself. Aspects like security were always one step back due to the fallacious feeling of the inherent security of these very tiny components. After realizing that the opposite is true, we have to focus on securing the critical devices against tampering, information theft, counterfeiting, etc. In scope of this paper, it means especially hindering of physical attacks on the chips.

Keywords

hybrid integrated circuits, integrated circuits, reverse engineering, security, three-dimensional integrated circuits

Authors

MALČÍK, D.; DRAHANSKÝ, M.

Released

1. 10. 2019

ISBN

2207-9629

Periodical

International Journal of Security and Its Applications

Year of study

13

Number

3

State

Australia

Pages from

17

Pages to

28

Pages count

12

URL

http://article.nadiapub.com/IJSIA/vol13_no3/3.html

BibTex

@article{BUT159978,
  author="Dominik {Malčík} and Martin {Drahanský}",
  title="Improving the Physical Security of Microchips",
  journal="International Journal of Security and Its Applications",
  year="2019",
  volume="13",
  number="3",
  pages="17--28",
  doi="10.33832/ijsia.2019.13.3.03",
  issn="2207-9629",
  url="http://article.nadiapub.com/IJSIA/vol13_no3/3.html"
}