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STACH, S. TALU, S. DALLAEV, R. ARMAN, A. SOBOLA, D. SALERNO, M.
Original Title
Evaluation of the Topographical Surface Changes of Silicon Wafers after Annealing and Plasma Cleaning
Type
journal article in Web of Science
Language
English
Original Abstract
The morphological stability of silicon single crystal wafers was investigated, after performing cleaning surface treatments based on moderate temperature annealing and plasma sputtering. The wafer surfaces were measured by Tapping mode atomic force microscopy in air, before and after the different treatments. The 3D images were segmented by watershed algorithm identifying the local peaks, and the stereometric parameters were extracted thereof. The analysis of variance allowed to better assess the statistically significant differences. All the resulting quantities were critically discussed. It appeared that the different cleaning treatments affected differently the surface morphology changes occurring between pristine and treated surfaces, making them distinguishable in these terms. The presented combination of measurement technique and analyzing protocol potentially allows one to assess the structural differences of the sufaces of interest, when assumptions area made about the physical origin of the emerging topographical features. In the present case, if no etching is assumed, it appears that all cleaning protocols actually worsen the surface quality. The effect of these morphological differences on the funtional properties of the surface should be ascertained independently.
Keywords
Silicon wafer, annealing, plasma sputtering, atomic force microscopy, watershed segmentation, stereometric analysis
Authors
STACH, S.; TALU, S.; DALLAEV, R.; ARMAN, A.; SOBOLA, D.; SALERNO, M.
Released
1. 1. 2020
ISBN
1876-990X
Periodical
Silicon
Year of study
11
Number
1
State
Kingdom of the Netherlands
Pages from
2563
Pages to
2570
Pages count
8
URL
https://link.springer.com/article/10.1007/s12633-019-00351-x
BibTex
@article{BUT160960, author="Sebastian {Stach} and Stefan {Talu} and Rashid {Dallaev} and Ali {Arman} and Dinara {Sobola} and Marco {Salerno}", title="Evaluation of the Topographical Surface Changes of Silicon Wafers after Annealing and Plasma Cleaning", journal="Silicon", year="2020", volume="11", number="1", pages="2563--2570", doi="10.1007/s12633-019-00351-x", issn="1876-990X", url="https://link.springer.com/article/10.1007/s12633-019-00351-x" }