Přístupnostní navigace
E-application
Search Search Close
Publication detail
OTÁHAL, A. SKÁCEL, J. SZENDIUCH, I.
Original Title
Influence of Electric Current at Solidification of Solder
Type
conference paper
Language
English
Original Abstract
This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscopy.
Keywords
scanning electron microscopy, soldering, solders solidification,
Authors
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.
Released
26. 8. 2019
Publisher
IEEE
ISBN
2161-2528
Periodical
Electronics Technology (ISSE)
State
United States of America
Pages from
1
Pages to
5
Pages count
URL
https://ieeexplore.ieee.org/document/8810308
BibTex
@inproceedings{BUT161228, author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch}", title="Influence of Electric Current at Solidification of Solder", booktitle="42nd International Spring Seminar on Electronics Technology (ISSE).", year="2019", journal="Electronics Technology (ISSE)", pages="1--5", publisher="IEEE", doi="10.1109/ISSE.2019.8810308", issn="2161-2528", url="https://ieeexplore.ieee.org/document/8810308" }