Publication detail

3D Spatial Resolution Evaluation for Helical CT According to ASTM E1695–95

LÁZŇOVSKÝ, J. BŘÍNEK, A. ŠALPLACHTA, J. ZIKMUND, T. YOUNG, B. PATÁKOVÁ, Z. KAISER, J.

Original Title

3D Spatial Resolution Evaluation for Helical CT According to ASTM E1695–95

Type

article in a collection out of WoS and Scopus

Language

English

Original Abstract

Knowledge of valid spatial resolution is essential for qualitative analysis using X-ray computed tomography. Due to spatial resolution, it is possible to determine with what detectability the imaging system can measure an internal structure. Based on the spatial resolution knowledge, the smallest object size that can be distinguished in resulting images can be determined. Each component in the imaging system affects the value of spatial resolution, and the final value is defined as a product of all comprised components. In this paper, spatial resolution according to standard ASTM E1695–95 was calculated. This standard uses edge response function (ERF), point spread function (PSF) to modulation transfer function (MTF) approach for the calculation of spatial resolution in each plane. For the calculation was used a sphere phantom, which is convenient for the study of spatial resolution in all three orthogonal planes. Spatial resolution was tested on spheres from two different materials, to observe the effect of material on spatial resolution in all three dimensions.

Keywords

X-ray computed tomography; Helical CT; Spatial resolution; Space filling; self calibrated system

Authors

LÁZŇOVSKÝ, J.; BŘÍNEK, A.; ŠALPLACHTA, J.; ZIKMUND, T.; YOUNG, B.; PATÁKOVÁ, Z.; KAISER, J.

Released

1. 2. 2020

Pages from

1

Pages to

6

Pages count

6

URL

BibTex

@inproceedings{BUT162151,
  author="LÁZŇOVSKÝ, J. and BŘÍNEK, A. and ŠALPLACHTA, J. and ZIKMUND, T. and YOUNG, B. and PATÁKOVÁ, Z. and KAISER, J.",
  title="3D Spatial Resolution Evaluation for Helical CT According to ASTM E1695–95",
  year="2020",
  pages="1--6",
  url="https://www.ndt.net/article/ctc2020/papers/ICT2020_paper_id155.pdf"
}