Publication detail
Optimalization and Investigation of the Free Air Ball Formation of the Gold Wire Bond
BÚRAN, M. ŘEZNÍČEK, M.
Original Title
Optimalization and Investigation of the Free Air Ball Formation of the Gold Wire Bond
Type
conference proceedings
Language
English
Original Abstract
This paper deals with Free air ball (FAB) formation and its optimization. It is part of the thermocompression of the thermosonic wire bonding process. This paper consists of a theoretical introduction to the topic and specific technological steps that is crucial for correct FAB formation. Technological parameters that can have an impact on the FAB formation process were analyzed. These are for example power of the electric discharge, length of the wire tail or protective atmosphere in the case of corrosive materials of the wire. The impact of these parameters on the quality of the reliability of the FAB and the wire-bonded joint were evaluated. At the end of this paper is a recommendation for the optimization of the wire bonding process for the small amount of the semiconductor chips.
Keywords
Free air ball, optimization, gold, silver, wire tail, discharge
Authors
BÚRAN, M.; ŘEZNÍČEK, M.
Released
30. 4. 2020
Location
Brno
ISBN
ISBN 978-80-214-5867
Book
Proceedings I of the 26th Conference STUDENT EEICT 2020
Pages count
5
URL
BibTex
@proceedings{BUT164494,
editor="Martin {Búran} and Michal {Řezníček}",
title="Optimalization and Investigation of the Free Air
Ball Formation of the Gold Wire Bond",
year="2020",
pages="5",
address="Brno",
isbn="ISBN 978-80-214-5867",
url="https://www.fekt.vut.cz/conf/EEICT/archiv/sborniky/EEICT_2020_sbornik_1.pdf"
}