Publication detail

Cooling of minimized surface-mount packages in power electronics applications

ŠÍR, M. FENO, I.

Original Title

Cooling of minimized surface-mount packages in power electronics applications

Type

journal article in Web of Science

Language

English

Original Abstract

With rise of GaN and SiC semiconductors in last few years, amount of available power semiconductors in minimized surface mount packages significantly increased. Together with rising pressure to increase power density of power conversion systems became effective design of cooling crucial. The aim of this article is to propose innovative methods of cooling of minimized surface mount packages, especially in application of power electronics. Article presents FEM thermal simulation of several possible variants of problem solution and provides results of measurement on physical prototypes with intention to compare. Results shows that the future of cooling in power electronics belongs to printed circuit boards with metal substrate.

Keywords

power electronics, thermal vias, thermal management, surface mount package cooling, cooling of GaN

Authors

ŠÍR, M.; FENO, I.

Released

20. 8. 2020

Publisher

Przeglad Elektrotechniczny

Location

Warsaw, Poland

ISBN

0033-2097

Periodical

Przeglad Elektrotechniczny

Year of study

2020

Number

11

State

Republic of Poland

Pages from

151

Pages to

154

Pages count

4

URL

http://pe.org.pl/index.php?lang=1

BibTex

@article{BUT164749,
  author="Michal {Šír} and Ivan {Feno}",
  title="Cooling of minimized surface-mount packages in power
electronics applications",
  journal="Przeglad Elektrotechniczny",
  year="2020",
  volume="2020",
  number="11",
  pages="151--154",
  doi="10.15199/48.2020.11.31",
  issn="0033-2097",
  url="http://pe.org.pl/index.php?lang=1"
}