Publication detail

The Analysis of Wire Bonding Reliability under Critical Operating Conditions

BÚRAN, M. ŘEZNÍČEK, M.

Original Title

The Analysis of Wire Bonding Reliability under Critical Operating Conditions

Type

conference paper

Language

English

Original Abstract

This study deals with properties of the wire bond connection under critical operating conditions. Changes in electrical resistivity and mechanical strength of the connection were analyzed. In this case, critical conditions are high ambient temperature and a high current flowing through the wire bond. It was found that there is an insignificant change in electrical resistivity of a 17,5 μm and 25,4 μm thick golden wire that was welded on thick golden film layer. However, a significant change was found in mechanical strength. The idea of an experiment is based on an assumption that this effect depends on the structure of the bonding pad and structural change of the golden wire.

Keywords

wire bonding, reliability, mechanical strength, current

Authors

BÚRAN, M.; ŘEZNÍČEK, M.

Released

14. 5. 2020

Publisher

IEEE

ISBN

978-1-7281-6773-2

Book

43nd International Spring Seminar on Electronics Technology (ISSE).

ISBN

2161-2536

Periodical

International Spring Seminar on Electronics Technology ISSE

State

United States of America

Pages from

1

Pages to

4

Pages count

4

URL

https://ieeexplore.ieee.org/document/9120937

BibTex

@inproceedings{BUT164782,
  author="Martin {Búran} and Michal {Řezníček}",
  title="The Analysis of Wire Bonding Reliability under Critical Operating Conditions",
  booktitle="43nd International Spring Seminar on Electronics Technology (ISSE).",
  year="2020",
  journal="International Spring Seminar on Electronics Technology ISSE",
  pages="1--4",
  publisher="IEEE",
  doi="10.1109/ISSE49702.2020.9120937",
  isbn="978-1-7281-6773-2",
  issn="2161-2536",
  url="https://ieeexplore.ieee.org/document/9120937"
}