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OTÁHAL, A. SKÁCEL, J. SZENDIUCH, I.
Original Title
Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys
Type
conference paper
Language
English
Original Abstract
The main aim of this work was to determine and summarize the applicability of etching solutions for the preparation of examined solder joint samples after metallographic cross-sections. Each etchant has different etching rate for every element and compound thereby highlighting various information about the solder joint inner structure. These findings were subsequently used to recommend the choice of a given solution for certain information about the properties of the inner structure of the SAC305 solder joint. Four types of solutions with strong acid were used. The results showed that all etchants could be used for interfacial intermetallic compounds. However, only Etchant A and Etchant D were the most suitable for comprehensive examination of the SAC305 solder ball inner structure.
Keywords
copper alloys, etching, metallography, silver alloys, soldering, solders, tin alloys
Authors
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.
Released
19. 6. 2020
Publisher
IEEE
ISBN
978-1-7281-6773-2
Book
2020 43rd International Spring Seminar on Electronics Technology (ISSE)
2161-2536
Periodical
International Spring Seminar on Electronics Technology ISSE
State
United States of America
Pages from
1
Pages to
6
Pages count
URL
https://ieeexplore.ieee.org/document/9121138
BibTex
@inproceedings{BUT164803, author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch}", title="Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys", booktitle="2020 43rd International Spring Seminar on Electronics Technology (ISSE)", year="2020", journal="International Spring Seminar on Electronics Technology ISSE", pages="1--6", publisher="IEEE", doi="10.1109/ISSE49702.2020.9121138", isbn="978-1-7281-6773-2", issn="2161-2536", url="https://ieeexplore.ieee.org/document/9121138" }