Publication detail

Design of Building Blocks for Fractional-Order Applications with Single and Compact Active Device

ŠOTNER, R. JEŘÁBEK, J. LANGHAMMER, L. KOTON, J. POLÁK, J. ANDRIUKAITIS, D. VALINEVICIUS, A.

Original Title

Design of Building Blocks for Fractional-Order Applications with Single and Compact Active Device

Type

conference paper

Language

English

Original Abstract

This paper introduces new promising applications of VCA822 active device in the fractional-order design of two-ports including very simple and compact solutions of integrator, differentiator, low-pass and high-pass filter. Key feature of the designed circuits is their tunability controlled by current gain of VCA822 not available in case of solution with standard op-amps. Block (principal) structure of the device is explained in detail. PSpice simulation results of the designed circuits indicate usability of these ideas and also simple tunability of the application verified with a fractional-order constant phase element with the order alpha = 1/4.

Keywords

Constant phase element; differentiator; electronic adjustability; filter; fractional-order; integrator; tunability; VCA822.

Authors

ŠOTNER, R.; JEŘÁBEK, J.; LANGHAMMER, L.; KOTON, J.; POLÁK, J.; ANDRIUKAITIS, D.; VALINEVICIUS, A.

Released

9. 7. 2020

Publisher

IEEE

Location

Milan, Italy

ISBN

978-1-7281-6376-5

Book

Proceedings of 43rd International Conference on Telecommunications and Signal Processing (TSP)

Pages from

573

Pages to

577

Pages count

5

URL

https://ieeexplore.ieee.org/document/9163400

Full text in the Digital Library

http://hdl.handle.net/11012/245270

BibTex

@inproceedings{BUT165785,
  author="Roman {Šotner} and Jan {Jeřábek} and Lukáš {Langhammer} and Jaroslav {Koton} and Josef {Polák} and Darius {Andriukaitis} and Algimantas {Valinevicius}",
  title="Design of Building Blocks for Fractional-Order Applications with Single and Compact Active Device",
  booktitle="Proceedings of 43rd International Conference on Telecommunications and Signal Processing (TSP)",
  year="2020",
  pages="573--577",
  publisher="IEEE",
  address="Milan, Italy",
  doi="10.1109/TSP49548.2020.9163400",
  isbn="978-1-7281-6376-5",
  url="https://ieeexplore.ieee.org/document/9163400"
}