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Publication detail
KERNDL, M. ŠTEFFAN, P.
Original Title
Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production
Type
conference paper
Language
English
Original Abstract
The emerging Internet of Things (IoT) paradigm keeps pressure on constant innovation of manufacturing processes, mainly on additive technologies that can significantly reduce waste and cost of manufactured parts. Promising field for high volume, low cost and quick time to market additive fabrication method is printing. This paper briefly compares current printing technologies used for electronics fabrication, mainly for low cost Radio Frequency Identification (RFID), Near Field Communication (NFC) tags, smart labels, smart packaging, sensors etc. with focus on "offset lithography". This method raises a big challenges, one of them is chip contacting method. This work summarizes current contacting methods suitable for printed electronics on flexible substrates with focus on promising contactless RFID magnetic coupling method that does not require conductive connection between chip and antenna itself.
Keywords
IoT; Printed electronics; RFID; Chip Contacting; Conductive printing;
Authors
KERNDL, M.; ŠTEFFAN, P.
Released
26. 7. 2021
ISBN
978-1-6654-2933-7
Book
44th International Conference on Telecommunications and Signal Processing
Pages from
352
Pages to
356
Pages count
5
URL
https://ieeexplore.ieee.org/document/9522666
BibTex
@inproceedings{BUT171976, author="Michal {Kerndl} and Pavel {Šteffan}", title="Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production", booktitle="44th International Conference on Telecommunications and Signal Processing", year="2021", pages="352--356", doi="10.1109/TSP52935.2021.9522666", isbn="978-1-6654-2933-7", url="https://ieeexplore.ieee.org/document/9522666" }