Effect of temperature cycling on IMC growth and solder joint strength of SAC305 solder alloy and REL61 low silver alloy

article in a collection out of WoS and Scopus

English

This work deals with the comparison of the standard SAC305 (Sn 96,5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during temperature cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. Also, the mechanical strength of the solder joints in shear was measured. It can be concluded that the IMC growth on samples temperature cycled according the TC1 did not exceed the critical limit where the solder joint would be weakened for both alloys. For the samples temperature cycled according TC2 the IMC growth were lower in compare with samples cycled according TC1 but the impact on the shear strength is higher. It was also found that REL61 alloy achieved higher shear strength of the solder joint than SAC305 alloy. From the above findings, it can be concluded that in terms of the growth of the IMC layer under thermal stress and its effect on the shear strength of the solder joint, the REL61 solder alloy can be used as a replacement for SAC305.

SAC305, REL61, IMC, temperature cycling, shear strength

DOKOUPIL, J.; STARÝ, J.

23. 8. 2021

Brno University of Technology

Brno, CZ

978-80-214-5975-5

Advanced Batteries Accumulators and Fuel Cells – 22nd ABAF

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