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DOKOUPIL, J. STARÝ, J.
Original Title
Effect of Temperature Cycling on IMC Growth and Solder Joint Strength of SAC305 Solder Alloy and Low Silver Alloy REL61
Type
conference paper
Language
English
Original Abstract
This work deals with the comparison of the standard SAC305 (Sn 96.5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during thermal cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. No negative effect of REL61 solder alloy on the growth of the IMC layer under thermal stress and on the subsequent shear strength of the solder joint was found. From this point of view, the REL61 solder alloy can be used as a replacement for the SAC305 solder alloy.
Keywords
SAC305; REL61; IMC; temperature cycling; shear strength
Authors
DOKOUPIL, J.; STARÝ, J.
Released
8. 12. 2021
Publisher
ECS - The Electrochemical Society
Location
Pennington, New Jersey 08534-2839, USA
ISBN
1938-6737
Periodical
ECS Transaction
Number
105
State
United States of America
Pages from
391
Pages to
400
Pages count
10
BibTex
@inproceedings{BUT175426, author="Jakub {Dokoupil} and Jiří {Starý}", title="Effect of Temperature Cycling on IMC Growth and Solder Joint Strength of SAC305 Solder Alloy and Low Silver Alloy REL61", booktitle="22nd International Conference Advanced Batteries, Accumulators and Fuel Cells", year="2021", series="Volume 105", journal="ECS Transaction", number="105", pages="391--400", publisher="ECS - The Electrochemical Society", address="Pennington, New Jersey 08534-2839, USA", doi="10.1149/10501.0391ecst", issn="1938-6737" }